高可靠性電子裝備PCBA設(shè)計(jì)缺陷案例分析及可制造性設(shè)計(jì)

第1章總則

1.1　概述 ................................................................................................................................1

1.2　我國(guó)電子制造業(yè)面臨的困境 ..................................................................................2

1.2.1 困境之一：高端芯片的缺失 .............................................................................2

1.2.2 困境之二：DFM的嚴(yán)重缺失 ...........................................................................4

1.2.3 困境之三：不適應(yīng)先進(jìn)生產(chǎn)力發(fā)展的舊工藝管理體制 .................................6

1.2.4 困境之四：被嚴(yán)重低估了的工藝和制造價(jià)值 .................................................7

1.2.5 被扭曲了的電子裝聯(lián)標(biāo)準(zhǔn) ................................................................................8

1.3　實(shí)現(xiàn)高可靠質(zhì)量目標(biāo)的因素 ..................................................................................9

1.4　中國(guó)制造需要“大國(guó)工藝” ..................................................................................10

1.4.1 精湛的工匠技藝源自先進(jìn)的工藝技術(shù) ...........................................................10

1.4.2 電子裝聯(lián)技術(shù)的重要性 ...................................................................................11

1.5　先進(jìn)制造技術(shù) ...........................................................................................................12

1.5.1 什么是先進(jìn)制造技術(shù) .......................................................................................12

1.5.2 電氣互連先進(jìn)制造技術(shù) ...................................................................................12

1.5.3 新型元器件與高密度組裝技術(shù) .......................................................................12

1.5.4 微組裝先進(jìn)制造技術(shù) .......................................................................................13

1.5.5 可制造性設(shè)計(jì)是實(shí)現(xiàn)先進(jìn)制造技術(shù)的前提和技術(shù)支撐 ...............................13

1.6　可制造性設(shè)計(jì)理念的拓展.....................................................................................14

1.7　結(jié)束語 .........................................................................................................................15

第2章PCB/PCBA設(shè)計(jì)缺陷案例分析

2.1　焊盤尺寸設(shè)計(jì)缺陷 ..................................................................................................16

2.1.1 片式元器件焊盤設(shè)計(jì)缺陷 ...............................................................................17

2.1.2 片式元器件錯(cuò)誤的“常見病、多發(fā)病” ........................................................20

2.1.3 焊盤兩端不對(duì)稱，走線不規(guī)范 .......................................................................21

2.1.4 焊盤寬度及相互間距離不均勻 .......................................................................23

2.1.5 IC焊盤寬度間距過大 ......................................................................................23

2.1.6 QFN焊盤設(shè)計(jì)缺陷 ..........................................................................................24

2.1.7 安裝孔金屬化，焊盤設(shè)計(jì)不合理 ...................................................................25

2.1.8 共用焊盤問題導(dǎo)致的缺陷 ...............................................................................26

2.1.9 熱焊盤設(shè)計(jì)不合理 ...........................................................................................26

2.1.10 片式電容器焊盤長(zhǎng)度設(shè)計(jì)不合理 .................................................................28

2.1.11 其他焊盤設(shè)計(jì)缺陷 .........................................................................................28

2.2　絲網(wǎng)和阻焊膜設(shè)計(jì)不良 .........................................................................................30

2.2.1 絲網(wǎng)設(shè)計(jì)不良 ...................................................................................................30

2.2.2 阻焊膜設(shè)計(jì)不良 ...............................................................................................33

2.3　元器件布局不合理 ..................................................................................................35

2.3.1 布局設(shè)計(jì)不良 ...................................................................................................35

2.3.2 應(yīng)用波峰焊接工藝時(shí)，元器件布局沒有采取克服“陰影效應(yīng)”措施 .......37

2.3.3 元器件的排布不符合工藝要求 .......................................................................37

2.3.4 安放在PCB焊接面的QFP和SOIP沒有設(shè)計(jì)成“菱形”和設(shè)計(jì)導(dǎo)流盤 ........37

2.3.5 雙面組裝PCBA焊接面元器件焊盤或本體邊緣與插件零件邊緣距離過小 ..............38

2.3.6 元器件布放不符合自動(dòng)化生產(chǎn)要求 ...............................................................38

2.3.7 元器件布放位置距緊固件太近的設(shè)計(jì)缺陷 ...................................................39

2.3.8 波峰焊應(yīng)用中的布局設(shè)計(jì)缺陷 .......................................................................40

2.3.9 再流焊應(yīng)用中的布局設(shè)計(jì)缺陷 .......................................................................42

2.3.10 PCB布局混亂，嚴(yán)重影響焊接可靠性 ........................................................42

2.4　拼板設(shè)計(jì)不正確 .......................................................................................................44

2.5　PCB材料與尺寸不合適........................................................................................46

2.5.1 翹曲、扭曲 .......................................................................................................46

2.5.2 PCB材質(zhì)選用不當(dāng)，制作質(zhì)量低劣 ..............................................................48

2.6　BGA的常見設(shè)計(jì)問題 ...........................................................................................49

2.7　_通孔插裝中元器件引線直徑與金屬化孔孔徑和焊盤的不匹配 ................51

2.8　“飛線”問題 ..............................................................................................................54

2.9　PCB缺少工藝邊或工藝邊設(shè)計(jì)不合理 ............................................................54

2.10　插裝元器件安裝設(shè)計(jì)不良 ...............................................................................59

2.11　導(dǎo)通孔設(shè)計(jì)不良 ..................................................................................................61

2.11.1 導(dǎo)通孔設(shè)計(jì)在焊盤上 .....................................................................................61

2.11.2 導(dǎo)通孔與焊盤或元器件距離過小 .................................................................63

2.11.3 導(dǎo)通孔在屏蔽罩位置 .....................................................................................67

2.11.4 導(dǎo)通孔尺寸過大 .............................................................................................67

2.11.5 導(dǎo)通孔在元器件底部 .....................................................................................68

2.12　電連接器接觸偶與金屬化孔間隙比 ...............................................................69

2.13　PCB缺少定位孔，定位孔位置不正確 .......................................................70

2.14　焊盤與導(dǎo)線的連接 ...............................................................................................71

2.15　PCB基準(zhǔn)識(shí)別點(diǎn)缺失、設(shè)計(jì)不規(guī)范 ...........................................................72

2.16　元器件裝配設(shè)計(jì)不良 ........................................................................................74

2.17　設(shè)計(jì)缺陷所造成的焊接缺陷 .............................................................................95

2.17.1 插裝設(shè)計(jì)缺陷所造成的焊接缺陷 .................................................................95

2.17.2 貼裝 .................................................................................................................97

2.18　大面積接地和大面積PCB應(yīng)用設(shè)計(jì)缺陷 ...................................................99

2.19　工藝設(shè)計(jì)錯(cuò)誤 ......................................................................................................100

2.20　鍍金引線/焊端直接進(jìn)行錫焊的缺陷案例分析 ......................................101

2.21　多種設(shè)計(jì)缺陷 ......................................................................................................101

2.22　_因設(shè)計(jì)缺陷、物流控制失控和焊接溫度不符合規(guī)定要求引起的焊接故障 ................................................................................................................102

2.22.1 虛焊與冷焊 ...................................................................................................102

2.22.2 金屬化孔透錫率不符合要求 .......................................................................104

2.23　設(shè)計(jì)缺陷對(duì)元器件返修返工的影響 .............................................................105

2.24　設(shè)計(jì)缺陷對(duì)檢驗(yàn)檢測(cè)的影響 ...........................................................................106

2.25　設(shè)計(jì)缺陷對(duì)清洗的影響 ....................................................................................106

2.26　印制電路板組件的反變形安裝 ......................................................................106

2.27　潮濕敏感元器件（MSD）損壞 .....................................................................110

2.28　靜電敏感元器件使用上的錯(cuò)誤 .......................................................................111

2.29　返工返修（電裝整修，二次焊接） ................................................................112

2.30　電子產(chǎn)品電路設(shè)計(jì)及制造缺陷實(shí)例 .............................................................113

第3章現(xiàn)代電子裝聯(lián)核心理念及發(fā)展趨勢(shì)

3.1　現(xiàn)代電子裝聯(lián)核心理念 .......................................................................................117

3.1.1 電子裝聯(lián)技術(shù)與產(chǎn)品質(zhì)量的關(guān)系 .................................................................117

3.1.2 應(yīng)用DFX實(shí)施軍品可靠性設(shè)計(jì) ...................................................................117

3.1.3 基本概念 .........................................................................................................119

3.1.4 現(xiàn)代電子裝聯(lián)核心理念 .................................................................................122

3.2　電路設(shè)計(jì)現(xiàn)狀 .........................................................................................................126

3.2.1 引言 .................................................................................................................126

3.2.2 概述 .................................................................................................................126

3.2.3 電路設(shè)計(jì)功能的逐漸弱化 .............................................................................127

3.3　電子裝聯(lián)技術(shù)的迅速發(fā)展...................................................................................129

3.3.1 電子裝聯(lián)工程的基本概念 .............................................................................129

3.3.2 電子裝聯(lián)元器件的高速發(fā)展 .........................................................................132

3.3.3 可制造性分析軟件的應(yīng)用 .............................................................................134

3.3.4 國(guó)內(nèi)電子研制生產(chǎn)企業(yè)可制造性分析軟件應(yīng)用嚴(yán)重滯后原因分析 .........149

3.3.5 構(gòu)建DFM平臺(tái) ..............................................................................................152

3.3.6 可制造性分析與可制造性設(shè)計(jì) .....................................................................153

3.4　板級(jí)電路組裝技術(shù)的發(fā)展趨勢(shì) .........................................................................154

3.4.1 元器件級(jí) .........................................................................................................154

3.4.2 板級(jí)電路模塊 .................................................................................................154

3.4.3 post-SMT .......................................................................................................155

3.4.4 堆疊裝配技術(shù) .................................................................................................157

3.4.5 高密度組裝中的“微焊接”工藝設(shè)計(jì) ........................................................159

3.4.6 電子產(chǎn)品高密度小型化設(shè)計(jì) .........................................................................159

3.5　微波組件基本概念及應(yīng)用技術(shù)標(biāo)準(zhǔn)現(xiàn)狀 .......................................................161

3.5.1 微波組件基本概念 .........................................................................................161

3.5.2 微波電路應(yīng)用標(biāo)準(zhǔn)現(xiàn)狀 .................................................................................162

3.6　微組裝技術(shù)基本概念及標(biāo)準(zhǔn)應(yīng)用現(xiàn)狀 ............................................................164

3.6.1 微組裝技術(shù)的特征 .........................................................................................165

3.6.2 微組裝技術(shù)的定義及關(guān)鍵點(diǎn) .........................................................................165

3.6.3 微組裝技術(shù)應(yīng)用標(biāo)準(zhǔn)現(xiàn)狀 .............................................................................166

3.6.4 微組裝結(jié)構(gòu) .....................................................................................................168

3.6.5 微波組件微組裝技術(shù)的應(yīng)用 .........................................................................172

3.7　整機(jī)級(jí)先進(jìn)制造技術(shù) ............................................................................................175

3.7.1 3D線扎設(shè)計(jì) ...................................................................................................175

3.7.2 立體建模的條件 .............................................................................................176

3.7.3 存在問題 .........................................................................................................176

3.7.4 3D布線的核心 ...............................................................................................177

3.7.5 整機(jī)/系統(tǒng)級(jí)“無線纜”連接技術(shù) ..........................................................177

3.7.6 剛-撓基板連接技術(shù) .....................................................................................178

3.7.7 背板連接技術(shù) .................................................................................................179

3.7.8 機(jī)架安裝 .........................................................................................................179

3.7.9 整機(jī)3D CAPP集成設(shè)計(jì)技術(shù) .......................................................................180

3.7.10 電子產(chǎn)品虛擬裝配技術(shù) ...............................................................................182

第4章電路可制造性設(shè)計(jì)基礎(chǔ)

4.1　概述 ............................................................................................................................184

4.1.1 電子產(chǎn)品電裝生產(chǎn)質(zhì)量問題的主要成因 .....................................................184

4.1.2 電路設(shè)計(jì)錯(cuò)誤或缺乏可制造性給制造帶來了什么 .....................................185

4.1.3 不使用DFM可能面臨高成本與高風(fēng)險(xiǎn)的巨大挑戰(zhàn) ..................................186

4.1.4 可制造性設(shè)計(jì)的嚴(yán)重缺失是導(dǎo)致國(guó)內(nèi)外電子產(chǎn)品質(zhì)量差別的核心

要素之一 ........................................................................................................186

4.1.5 實(shí)施DFM提高核心競(jìng)爭(zhēng)力 ..........................................................................187

4.1.6 在設(shè)計(jì)初期進(jìn)行DFM ...................................................................................187

4.1.7 DFM是面向產(chǎn)品生命周期各環(huán)節(jié)設(shè)計(jì)的關(guān)鍵 ..........................................187

4.1.8 DFM不是單純的一項(xiàng)技術(shù)，它是一種思想，一個(gè)先進(jìn)的理念 ..............188

4.1.9 引入DFM來提高利潤(rùn)和產(chǎn)量 ......................................................................189

4.1.10 執(zhí)行IPC、MIL或GJB、GB及行業(yè)標(biāo)準(zhǔn)的前提 ....................................189

4.1.11 缺乏DFM到處存在 ....................................................................................189

4.1.12 對(duì)設(shè)計(jì)缺陷的錯(cuò)誤認(rèn)識(shí) ...............................................................................191

4.1.13 產(chǎn)品的質(zhì)量和可靠性是設(shè)計(jì)出來的 ...........................................................192

4.2　電路可制造性設(shè)計(jì)是嶄新的概念 .....................................................................192

4.2.1 電路可制造性設(shè)計(jì)是一個(gè)嶄新的概念 .........................................................192

4.2.2 可制造性設(shè)計(jì)應(yīng)用的廣泛性 .........................................................................192

4.3　概述 ............................................................................................................................193

4.3.1 可制造性設(shè)計(jì)主要解決什么問題 .................................................................193

4.3.2 電路、結(jié)構(gòu)和工藝三者之間的關(guān)系 .............................................................194

4.4　電路可制造性設(shè)計(jì)基本文件 ..............................................................................194

4.4.1 電子裝聯(lián)用基本電路設(shè)計(jì)文件 .....................................................................194

4.4.2 電子裝聯(lián)常用標(biāo)準(zhǔn) .........................................................................................195

4.4.3 企業(yè)技術(shù)標(biāo)準(zhǔn)（典型工藝規(guī)范） ...................................................................204

4.4.4 電子裝聯(lián)常用產(chǎn)品工藝文件 .........................................................................205

4.5　可制造性設(shè)計(jì)（DFM）的基本理念 ..............................................................206

4.5.1 可制造性設(shè)計(jì)與設(shè)計(jì)工藝性或可生產(chǎn)性是一致的 .....................................206

4.5.2 DFM的誕生 ...................................................................................................207

4.5.3 DFM的定義 ...................................................................................................208

4.5.4 DFM基本工作目標(biāo) .......................................................................................208

4.5.5 DFM的職責(zé) ..................................................................................................209

4.5.6 DFM的相關(guān)活動(dòng) ..........................................................................................210

4.5.7 DFM主要活動(dòng)與原理 ...................................................................................210

4.5.8 DFM 團(tuán)隊(duì)與主要職責(zé) ...................................................................................210

4.5.9 支持 DFM 工作的工具技能 ..........................................................................210

4.5.10 DFM系統(tǒng)的主要元素 .................................................................................211

4.5.11 DFM的涵蓋面及定義 .................................................................................211

4.5.12 SMT領(lǐng)域的DFM ........................................................................................211

4.5.13 電路可制造性設(shè)計(jì)的基本理念及意義 .......................................................212

4.5.14 應(yīng)用先進(jìn)電子裝聯(lián)技術(shù)的電路可制造性設(shè)計(jì) ...........................................213

4.6　關(guān)鍵在于理念的更新 ............................................................................................215

第5章PCB/PCBA可制造性設(shè)計(jì)（DFM）

5.1　概述 ............................................................................................................................216

5.2　PCBA設(shè)計(jì)缺陷的影響 ......................................................................................217

5.3　印制電路板組件DFM的核心理念 .................................................................218

5.4　可制造性設(shè)計(jì)的組織保證措施 .........................................................................219

5.5　可制造性設(shè)計(jì)實(shí)施方案 .......................................................................................219

5.6　電路設(shè)計(jì)文件可制造性審核（工藝性審核） ................................................220

5.6.1 電路設(shè)計(jì)文件工藝性審查的形式 .................................................................220

5.6.2 電路設(shè)計(jì)文件工藝性審查（以PCBA為例） ..............................................221

5.6.3 電裝工藝設(shè)計(jì)原則與依據(jù) .............................................................................227

5.6.4 工藝性審查存在的問題 .................................................................................228

5.7　印制電路組件可制造性設(shè)計(jì)（DFM）基本概念 .......................................228

5.7.1 印制電路板可制造性設(shè)計(jì) .............................................................................228

5.7.2 印制電路板可制造性設(shè)計(jì)目的 .....................................................................228

5.7.3 印制電路板可制造性設(shè)計(jì)范圍 .....................................................................229

5.7.4 印制電路板可制造性設(shè)計(jì)的重點(diǎn) .................................................................229

5.7.5 印制電路板可制造性設(shè)計(jì)內(nèi)容 .....................................................................229

5.7.6 可制造性設(shè)計(jì)程序解析 .................................................................................229

5.7.7 PCBA組裝方式?jīng)Q定焊接工藝流程 .............................................................231

5.7.8 印制電路板電路設(shè)計(jì) .....................................................................................239

5.8　確保PCBA可制造性設(shè)計(jì)實(shí)施的物料要素 .................................................243

5.8.1 總則 .................................................................................................................243

5.8.2 高可靠印制電路板的可接受條件 .................................................................244

5.8.3 高可靠電子裝備電子元器件選用要求 .........................................................248

第6章PCB元器件布局設(shè)計(jì)及焊盤設(shè)計(jì)

6.1　表面組裝技術(shù)元器件布局設(shè)計(jì)及片式元器件焊盤設(shè)計(jì) .................................254

6.1.1 表面貼裝元器件的焊接可靠性 .....................................................................254

6.1.2 SMT印制電路板電路設(shè)計(jì)一般要求 ..........................................................255

6.1.3 SMT工藝對(duì)元器件布局設(shè)計(jì)的要求 ..........................................................257

6.1.4 采用再流焊接焊工藝的元器件焊盤設(shè)計(jì) .....................................................261

6.1.5 再流焊工藝導(dǎo)通孔設(shè)計(jì) .................................................................................373

6.2　波峰焊工藝元器件布局設(shè)計(jì)及焊盤圖形設(shè)計(jì) ..............................................374

6.2.1 采用傳統(tǒng)波峰焊工藝的元器件布局設(shè)計(jì) ...................................................374

6.2.2 采用傳統(tǒng)波峰焊工藝的元器件焊盤設(shè)計(jì) .....................................................380

第7章通用設(shè)計(jì)技術(shù)

7.1　通用設(shè)計(jì)...................................................................................................................385

7.1.1 焊盤形狀設(shè)計(jì) .................................................................................................385

7.1.2 焊盤與印制電路板的距離 .............................................................................386

7.1.3 焊盤的開口 .....................................................................................................386

7.1.4 相鄰焊盤設(shè)計(jì) .................................................................................................386

7.1.5 大型元器件焊盤設(shè)計(jì) .....................................................................................386

7.1.6 大導(dǎo)電面積設(shè)計(jì) .............................................................................................386

7.1.7 采用傳統(tǒng)波峰焊工藝時(shí)孔的設(shè)計(jì)規(guī)則 .........................................................386

7.1.8 焊盤設(shè)計(jì) .........................................................................................................388

7.1.9 焊盤與孔的關(guān)系 .............................................................................................389

7.1.10 導(dǎo)通孔與焊盤的連接設(shè)計(jì) ...........................................................................390

7.1.11 元器件孔距設(shè)計(jì) ...........................................................................................395

7.1.12 環(huán)寬要求 .......................................................................................................395

7.1.13 導(dǎo)體層的隔熱設(shè)計(jì) .......................................................................................396

7.1.14 THT圖形設(shè)計(jì) ..............................................................................................397

7.1.15 焊盤和印制導(dǎo)線的連接 ...............................................................................398

7.1.16 雙列直插式（DIP）集成電路焊盤設(shè)計(jì) ....................................................401

7.1.17 元器件的安裝間距 .......................................................................................403

7.1.18 布線設(shè)計(jì) .......................................................................................................415

7.1.19 模板設(shè)計(jì) .......................................................................................................428

7.2　設(shè)備對(duì)設(shè)計(jì)的要求 ................................................................................................441

7.2.1 印制電路板外形、尺寸設(shè)計(jì) .........................................................................442

7.2.2 印制電路板定位孔的設(shè)計(jì)要求 .....................................................................444

7.2.3 印制電路板夾持邊設(shè)計(jì) .................................................................................446

7.2.4 光學(xué)定位基準(zhǔn)標(biāo)志（Mark）設(shè)計(jì) ................................................................446

7.2.5 局部基準(zhǔn)標(biāo)志 .................................................................................................449

7.2.6 拼板設(shè)計(jì) .........................................................................................................450

7.2.7 選擇元器件封裝及包裝形式 .........................................................................454

7.3　阻焊、絲網(wǎng)的設(shè)計(jì) ................................................................................................454

7.3.1 阻焊膜設(shè)計(jì) .....................................................................................................454

7.3.2 絲網(wǎng)圖形設(shè)計(jì) .................................................................................................457

7.4　印制電路板組件導(dǎo)熱和散熱設(shè)計(jì) .....................................................................458

7.4.1 概述 ................................................................................................................458

7.4.2 印制電路板導(dǎo)熱和散熱設(shè)計(jì)工藝性要求 .....................................................459

7.4.3 元器件導(dǎo)熱和散熱設(shè)計(jì)要求 .........................................................................459

7.4.4 元器件導(dǎo)熱和散熱設(shè)計(jì)的主要填充材料和使用 .........................................460

7.4.5 印制電路板散熱設(shè)計(jì)的內(nèi)容和要求 .............................................................464

7.5　印制電路板制圖的基本要素 ..............................................................................470

7.5.1 印制電路板的表面鍍涂 .................................................................................470

7.5.2 印制電路板的標(biāo)記 .........................................................................................471

7.5.3 印制電路板圖樣的繪制 .................................................................................472

第8章通孔插裝元器件焊接工藝選擇

8.1　選擇性波峰焊接是PCBA焊接工藝流程的必然選擇 ..............................483

8.2　選擇性波峰焊接對(duì)比手工焊接 .........................................................................484

8.3　選擇性波峰焊接對(duì)比通孔回流焊接（PHR） ......................................487

8.3.1 通孔回流焊接工藝的優(yōu)點(diǎn) .............................................................................488

8.3.2 通孔回流焊接工藝的缺點(diǎn) .............................................................................488

8.3.3 通孔回流焊接工藝的適用條件（例） ...........................................................491

8.3.4 結(jié)束語 .............................................................................................................492

8.4　選擇性波峰焊接對(duì)比傳統(tǒng)波峰焊接 ................................................................493

8.4.1 雙面混裝焊接工藝比較 .................................................................................493

8.4.2 避免了傳統(tǒng)波峰焊接元器件布局的局限性 ...............................................496

8.4.3 使用帶有治具的傳統(tǒng)波峰焊接工藝 .............................................................500

8.4.4 選用選擇性波峰焊的優(yōu)越性 .........................................................................503

8.4.5 結(jié)束語 .............................................................................................................506

8.5　焊接質(zhì)量要求 .........................................................................................................507

8.5.1 焊接潤(rùn)濕角 .....................................................................................................507

8.5.2 良好的焊點(diǎn)要素 .............................................................................................511

8.5.3 通孔插裝元器件手工焊與選擇性波峰焊質(zhì)量比較 .....................................515

8.6　選擇性波峰焊導(dǎo)流盤的設(shè)置 ..............................................................................518

8.6.1 傳統(tǒng)雙波峰焊原理 .........................................................................................518

8.6.2 傳統(tǒng)的雙波峰焊時(shí)DIP元器件的焊盤排列走向、橋連產(chǎn)生的原因及

導(dǎo)流盤的設(shè)置 ................................................................................................518

8.6.3 橋連現(xiàn)象及其產(chǎn)生的原因 .............................................................................520

8.7　高密度高可靠PCBA焊接工藝流程選擇 .....................................................521

8.8　選擇性波峰焊對(duì)PCB/PCBA設(shè)計(jì)的要求...................................................522

8.8.1 PCB設(shè)計(jì)一般要求 ........................................................................................522

8.8.2 選擇性波峰焊PCB設(shè)計(jì)特殊要求 ...............................................................525

8.8.3 防止橋連工藝 .................................................................................................528

8.9　選擇性波峰焊的局限性 .......................................................................................530

8.10　與波峰焊相關(guān)的禁限用工藝 .........................................................................531

第9章PCBA元器件可組裝性設(shè)計(jì)（DFA）

9.1　通孔插裝元器件穿孔安裝...................................................................................532

9.1.1 一般要求 .........................................................................................................532

9.1.2 通孔插裝元器件安裝詳細(xì)要求 .....................................................................535

9.2　表面安裝...................................................................................................................563

9.2.1 有引線的表面安裝 .........................................................................................563

9.2.2 無引線的表面安裝 .........................................................................................564

9.2.3 GJB 3243、QJ 3086、QJ 3173A和QJ 165B規(guī)定的表面貼裝元器件

安裝要求 .........................................................................................................565

9.3　THC/THD在微波基板上的安裝焊接設(shè)計(jì) .................................................573

9.3.1 引線搭接 .........................................................................................................573

9.3.2 圓形引線搭接 .................................................................................................573

9.3.3 扁平引線搭接 .................................................................................................573

9.3.4 通孔插裝元器件引線的搭接焊接要求 .........................................................574

9.4　非返工返修PCBA的跨接線（飛線、跳線） ..............................................574

9.4.1 跨接線的定義 .................................................................................................574

9.4.2 跨接線一般使用原則 .....................................................................................575

9.4.3 特殊情況下允許使用跨接線的原則 .............................................................575

9.5　PCBA返修和返工中跨接線的處理 ................................................................576

9.5.1 增設(shè)跨接線原則 .............................................................................................576

9.5.2 跨接線所選用的導(dǎo)線的選擇 .........................................................................577

9.5.3 跨接線分類 .....................................................................................................577

9.5.4 跨接線的布線 .................................................................................................577

9.5.5 跨接線的連接 .................................................................................................579

9.5.6 THT跨接線焊接要求 ...................................................................................580

9.5.7 SMT跨接線焊接要求 ..................................................................................582

9.5.8 跨接線的黏接固定 .........................................................................................587

第10章高可靠PCBA禁限用工藝及分析

10.1　高可靠PCB/PCBA禁用設(shè)計(jì)與禁用安裝工藝 ......................................589

10.1.1 概述 ...............................................................................................................589

10.1.2 什么是禁用工藝 ...........................................................................................589

10.1.3 什么是限用工藝 ...........................................................................................590

10.1.4 高可靠PCB/PCBA禁用設(shè)計(jì)與禁用安裝工藝72條 ...............................590

10.1.5 高可靠電子設(shè)備禁用工藝與材料 ...............................................................592

10.1.6 高可靠電子設(shè)備限用工藝與設(shè)計(jì) ...............................................................593

10.2　_軍品PCBA軸向引線元器件通孔插裝安裝方式——不允許軸向引線元器件垂直安裝 .........................................................596

10.2.1 問題提出 .......................................................................................................596

10.2.2 軍品（3級(jí)或C級(jí)產(chǎn)品）PCBA軸向通孔插裝元器件 ...........................597

10.2.3 分析 ...............................................................................................................598

10.3　軍品（3級(jí)或C級(jí)產(chǎn)品）PCBA通孔插裝元器件要求 ..........................599

10.3.1 軸向引腳水平安裝 .......................................................................................599

10.3.2 徑向引腳水平安裝 .......................................................................................602

10.3.3 分析 ...............................................................................................................603

10.3.4 結(jié)束語 ...........................................................................................................604

10.4　3級(jí)電子產(chǎn)品PCBA片式元器件堆疊安裝分析 .....................................604

10.4.1 概述 ...............................................................................................................604

10.4.2 問題提出 .......................................................................................................605

10.4.3 軍標(biāo)對(duì)軍用PCBA“片式元器件堆疊安裝”的規(guī)定 ...............................606

10.4.4 分析 ...............................................................................................................606

10.4.5 試驗(yàn)驗(yàn)證 .......................................................................................................610

10.4.6 結(jié)束語 ...........................................................................................................610

10.5　F型封裝大功率管的安裝焊接 .......................................................................610

10.6　QJ 3117A《導(dǎo)線在印制電路板上搭接焊接》質(zhì)疑 .............................611

10.7　元器件鍍金引線/焊端除金搪錫 ..................................................................614

10.7.1 問題提出 .......................................................................................................615

10.7.2 元器件引腳/焊端未除金搪錫導(dǎo)致的金脆化案例 ...................................615

10.7.3 金脆化分析 ...................................................................................................619

10.7.4 鍍金引線/焊端的除金規(guī)定 .......................................................................621

10.7.5 無須糾結(jié)的鍍金引線/焊端除金處理 .......................................................623

10.7.6 元器件引線/焊端“除金”工藝 ...............................................................624

10.7.7 射頻電連接器焊杯除金工藝 .......................................................................627

10.7.8 低頻（多芯）電連接器焊杯除金工藝 .......................................................627

10.7.9 先進(jìn)除金搪錫設(shè)備及工藝介紹 ...................................................................632

10.7.10 鍍金PCB焊接中產(chǎn)生的金脆化案例 .......................................................637

10.7.11 鍍金引線除金的爭(zhēng)議 .................................................................................639

10.7.12 結(jié)束語 .........................................................................................................642

10.8　軍用PCBA通孔插裝元器件“禁止雙面焊” ............................................643

10.8.1 引言 ...............................................................................................................643

10.8.2 什么是禁限用工藝 .......................................................................................644

10.8.3 提出“禁止雙面焊”的必要性 ...................................................................644

10.8.4 基于Pro/Mechanical對(duì)透錫量的驗(yàn)證 .......................................................649

10.8.5 “禁止雙面焊”可以做到 .............................................................................655

10.8.6 影響通孔插裝元器件金屬化孔透錫率的主要因素 ...................................655

10.8.7 如何提高印制電路板金屬化孔透錫率 .......................................................657

10.8.8 實(shí)踐驗(yàn)證 ....................................................................................................664

10.8.9 結(jié)束語 ...........................................................................................................664

附錄A"para eb946e" label-module="para">2100433B

本書以豐富詳盡的設(shè)計(jì)缺陷案例分析為抓手，指出導(dǎo)致電子裝備質(zhì)量問題的主要因素是設(shè)計(jì)缺乏可制造性，在此基礎(chǔ)上以較大篇幅介紹PCB/PCBA可制造性設(shè)計(jì)的設(shè)計(jì)理念、設(shè)計(jì)程序和設(shè)計(jì)方法，創(chuàng)新性地將設(shè)計(jì)與工藝、工藝與工藝過程控制結(jié)合起來，以幫助電子企業(yè)的管理者、電路設(shè)計(jì)師和電子裝聯(lián)工藝師建立“設(shè)計(jì)是源頭，工藝是關(guān)鍵，物料是保障，管理是根本，理念是核心”的高可靠電子裝備電子裝聯(lián)核心理念，掌握可制造性設(shè)計(jì)程序和具體方法，并對(duì)業(yè)內(nèi)極為關(guān)注的若干現(xiàn)代電子裝聯(lián)技術(shù)問題進(jìn)行了答疑與詮釋。本書既可作為電路設(shè)計(jì)師、電子裝聯(lián)工藝師、產(chǎn)品質(zhì)量保障師、企業(yè)管理人員、電裝技師及高級(jí)技師等人員的工作指導(dǎo)手冊(cè)和培訓(xùn)教材，也可作為相關(guān)高等院校電路設(shè)計(jì)和工藝制造等專業(yè)師生的教學(xué)用書。

本書以提高電子產(chǎn)品可靠性為主線，從工藝角度系統(tǒng)介紹了包括設(shè)計(jì)、制造和使用維護(hù)在內(nèi)的產(chǎn)品全壽命周期過程中各個(gè)環(huán)節(jié)和不同階段的相關(guān)設(shè)計(jì)要求、設(shè)計(jì)方法和注意事項(xiàng)，內(nèi)容涉及可制造性、可裝配性、可測(cè)試性、可維護(hù)性等諸多方面。全書按照材料、零部組件、單機(jī)、整機(jī)的層次進(jìn)行敘述，分為元器件與材料工藝選型、可制造性設(shè)計(jì)、結(jié)構(gòu)設(shè)計(jì)與防護(hù)設(shè)計(jì)。與國(guó)內(nèi)同類書籍相比，本書具有內(nèi)容更全面、角度更新穎、案例更典型、實(shí)用性更強(qiáng)等特點(diǎn)。本書可作為電子產(chǎn)品結(jié)構(gòu)設(shè)計(jì)師、電路設(shè)計(jì)師的參考手冊(cè)，也可作為電裝工藝師、產(chǎn)品質(zhì)量工程師和檢測(cè)工程師及電裝操作人員的工作指導(dǎo)手冊(cè)和培訓(xùn)教材，還可作為相關(guān)院校電子產(chǎn)品設(shè)計(jì)和工藝制造專業(yè)師生的參考和教學(xué)用書。

王威，工學(xué)博士，高級(jí)工程師，廣東省電子學(xué)會(huì)SMT專業(yè)委員會(huì)資深專家委員，現(xiàn)任中國(guó)科學(xué)院長(zhǎng)春光機(jī)所電裝中心主任，在電子產(chǎn)品可靠性工程、電子產(chǎn)品可制造性設(shè)計(jì)和電子產(chǎn)品工藝可靠性設(shè)計(jì)等方面擁有豐富的實(shí)踐經(jīng)驗(yàn)。 2100433B

篇 設(shè)計(jì)質(zhì)量的現(xiàn)狀及面臨的問題

1 設(shè)計(jì)缺陷的背景和原因

2 設(shè)計(jì)業(yè)務(wù)和檢查審查的現(xiàn)狀

3 提高設(shè)計(jì)質(zhì)量的施策

第二篇 設(shè)計(jì)缺陷的案例及分析

1 概述

2 橋梁結(jié)構(gòu)的設(shè)計(jì)缺陷（50例）

2.1 缺陷案例概述

2.2 缺陷案例的分析

3 地下結(jié)構(gòu)的設(shè)計(jì)缺陷（50例）

3.1 缺陷案例概述

3.2 缺陷案例分析

4 附屬結(jié)構(gòu)的設(shè)計(jì)缺陷（16例）

4.1 缺陷案例概述

4.2 缺陷案例的分析

5 使用階段的缺陷（50例）

5.1 缺陷案例概述

5.2 缺陷案例分析

6 總結(jié)

第三篇 審查檢查制度和法律責(zé)任

1 日本的設(shè)計(jì)審查檢查制度

1.1 公路工程（國(guó)土交通?。?

1.2 公路工程（地方政府）

1.3 港灣工程

1.4 建筑工程

2 美國(guó)的設(shè)計(jì)審查檢查制度（加利福尼亞州）

2.1 概述

2.2 承包商的檢查

2.3 業(yè)主的審查

3 英國(guó)的設(shè)計(jì)審查檢查制度

3.1 概述

3.2 承包方的檢查

3.3 發(fā)包者的審查

4 德國(guó)的設(shè)計(jì)審查檢查制度

4.1 結(jié)構(gòu)檢查工程師制度概述

4.2 結(jié)構(gòu)檢查工程師制度下的檢查工作

5 設(shè)計(jì)施工總承包方式的設(shè)計(jì)審查檢查制度

5.1 設(shè)計(jì)施工總承包的設(shè)計(jì)檢查的重要性

5.2 仁川大橋（Incheon Bridge）的檢查制度

6 日本的設(shè)計(jì)者法律責(zé)任

6.1 設(shè)計(jì)單位的責(zé)任

6.2 設(shè)計(jì)人員的責(zé)任

6.3 缺陷擔(dān)保責(zé)任

6.4 業(yè)主索賠的動(dòng)向

7 美國(guó)的設(shè)計(jì)者法律責(zé)任

7.1 加利福尼亞州內(nèi)自治體外包合同中對(duì)賠償責(zé)任的規(guī)定

7.2 過失的解釋

8 英國(guó)的設(shè)計(jì)者法律責(zé)任

9 業(yè)主、承包商、審核者的責(zé)任分擔(dān)（事例）

9.1 土岐展覽連接橋事故

9.2 英國(guó)對(duì)責(zé)任分擔(dān)的規(guī)定

9.3 德國(guó)對(duì)責(zé)任分擔(dān)的規(guī)定

9.4 美國(guó)對(duì)責(zé)任分擔(dān)的規(guī)定

10 總結(jié)

第四篇 提高設(shè)計(jì)質(zhì)量的措施及實(shí)例

1 措施概述

1.1 總體構(gòu)思

1.2 缺陷案例的把握及檢查表的使用

1.3 工程信息共享系統(tǒng)

1.4 設(shè)計(jì)流程管理

1.5 審查機(jī)制的建立

2 提高審查和設(shè)計(jì)質(zhì)量的實(shí)例

2.1 由第三方機(jī)構(gòu)進(jìn)行審查的設(shè)計(jì)審查機(jī)制

2.2 動(dòng)態(tài)分析審查

2.3 橋梁設(shè)計(jì)值的宏觀數(shù)據(jù)分析

2.4 隧道設(shè)計(jì)值的宏觀數(shù)據(jù)分析

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