Wedge Bond

WirePullTesting概述

Wire Pull Testing (WPT), or bond pull testing, is one of several available time-zero tests for wire bond strength and quality. It consists of applying an upward force under the wire to be tested, effectively pulling the wire away from the die.

拉線測試(WPT)，或稱鍵合力度拉扯測試，是評價金線鍵合力度與質(zhì)量的有效方法之一。方法:在鍵合金線的下方施加一個向上的拉力使鍵合部從芯片表面被拉開，并對拉力的大小進行測量。

Wire pull testing requires a special equipment commonly referred to as a wire pull tester (or bond pull tester), which consists of two major parts: 1) a mechanism for applying the upward pulling force on the wire using a tool known as a pull hook; and 2) a calibrated instrument for measuring the force at which the wire eventually breaks. This breaking force is usually expressed in grams-force.

拉線測試所需設備:拉線測試設備(鍵合力度拉扯測試設備)，主要由兩部分構成，1)由一機械裝置驅(qū)動一拉鉤產(chǎn)生一向上的拉力，2)經(jīng)校準后的力度測試裝置，用來測量金線從芯片表面拉開時的力度。該力度一般用gF(克力)來表示。

There exist many variants or test conditions for performing the WPT, but the most widely used test condition for conventional wirebonded devices is the double-bond wire pull test. This procedure consists of applying the pull hook under a wire that is attached at both ends (say, one end to a bond pad on the die, and the other end to the bonding finger or bonding post of the package). The pull hook is usually positioned at the highest point along the loop of the wire, and the pulling force is usually applied perpendicular to the die surface (vertically if the die surface is horizontal).

目前有多種方法與測試環(huán)境對金線鍵合力度進行測試，但運用最多最廣泛的方法是雙線鍵合拉線測試。該方法將拉鉤置于已經(jīng)鍵合在芯片和封裝材料兩端的金線下方(即，其中一端為金線與芯片之間的鍵合點，另一端為金線與封裝材料之間的鍵合點)。拉鉤通常置于金線弧度的最高點，拉扯力度方向與芯片表面垂直(若芯片表面為一平面)。

The wire pull tester measures the pulling force at which the wire or bond fails. The measured force is then recorded in grams-force. Aside from the bond strength reading, the operator must also record the bond failure mode. Failure mode in this context refers to one of the following: 1) first bond (ball bond) lifting; 2) neck break; 3) midspan wire break; 4) heel break; and 5) second bond (wedge bond) lifting. First or second bond lifting is unacceptable and should prompt the process owner to investigate why such a failure mode occurred.

拉線測試裝置用于測試金線被拉扯開時代力度，該力度用gF(克力)單位記錄。在記錄鍵合力度讀數(shù)的同時，亦需記錄拉線失效模式。拉線失效模式為以下之一:1)第一鍵合點(金球鍵合點)被拉起，2)金線頸部斷開，3)金線中部斷開(指金線弧度與線腳之間--NovHeaven)，4)線腳部分斷開，5)第二鍵合點(楔型線腳)被拉起。其中第一鍵合點與第二鍵合點被拉起的模式是不被接受的，需提示流程負責人研究其產(chǎn)生的原因。

拉線測試一般用于半導體封裝流程的前段，其為監(jiān)控生產(chǎn)能力與穩(wěn)定性的重要標準之一，一般SPC測試中的重要一項。

拉線測試相關國際標準:MIL-STD-883E-2011 (美軍標MIL-STD-883E中的方法2011，該標準為非互聯(lián)網(wǎng)免費共享，需購買)。

詞目：水膠聯(lián)結

英文：hydrogel bond,bound water bond

釋文：水膠聯(lián)結又稱結合水聯(lián)結，是由結合水膜將土粒聯(lián)結在一起的聯(lián)結類型。被生在粘性土中的水聯(lián)結。